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期刊论文 25

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2023 5

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微机电系统 3

仪器仪表 1

仿生智能技术 1

体硅键合技术 1

力矩反馈器 1

加热、通风和空调 1

医疗仪器 1

半导体可靠性 1

单芯片 1

场效应管 1

弯曲结构表面；柔性加速度计；微机电系统（MEMS）技术；无线非接触式测量 1

微力传感器 1

微机电系统(MEMS) 1

微电子机械系统封装技术 1

微系统 1

无线通信系统 1

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智能无人飞行器技术 1

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

《机械工程前沿（英文）》 2006年第1卷第2期页码 238-241 doi: 10.1007/s11465-006-0011-5

摘要： Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, and bonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors. The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, and then Si-Au alloy bonding was formed by annealing at 400vH for 2 h. The air sealability of the cavity after bonding was finally tested using the N filling method. The results indicate that large bond strength was obtained at the bonding interface. This process was used in fabricating a pressure sensor with a sandwich structure. The results indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging.

关键词： Si/Au-glass strength MEMS packaging process sandwich structure

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用于微电子机械系统封装的体硅键合技术和薄膜密封技术

王渭源,王跃林

《中国工程科学》 2002年第4卷第6期页码 56-62

摘要：

对静电键合、体硅直接键合和界面层辅助键合等三种体硅键合技术，整片操作、局部操作和选择保护等三种密封技术，以及这些技术用于微电子机械系统的密封作了评述，强调在器件研究开始时应考虑封装问题，具体技术则应在保证器件功能和尽量减少芯片复杂性两者之间权衡决定。

关键词：体硅键合技术薄膜密封技术微电子机械系统封装技术

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Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

《机械工程前沿（英文）》 2017年第12卷第4期页码 457-458 doi: 10.1007/s11465-017-0492-4

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Anthocyanins/chitosan films doped by nano zinc oxide for active and intelligent packaging: comparison

《化学科学与工程前沿（英文）》 2023年第17卷第6期页码 704-715 doi: 10.1007/s11705-022-2270-z

摘要： The multifunctional films was prepared by blending chitosan and nano-ZnO with purple tomato anthocyanins or black wolfberry anthocyanins. The properties of films functioned by anthocyanins source and nano-ZnO content were studied. It was found purple tomato anthocyanins showed more significant color change against pH than black wolfberry anthocyanins. The nano-ZnO were widely dispersed in matrix and enhanced the compatibility of anthocyanins with chitosan. However, the anthocyanins source influenced the properties of the films more slightly than nano-ZnO addition. The tensile strength, antioxidant and antibacterial effects of the chitosan films dramatically increased after cooperated by nano-ZnO and anthocyanins, which also enhanced with increase of nano-ZnO content, whereas the elongation at break of the composite films decreased. Especially, the anthocyanin and nano-ZnO promoted the antibacterial activity of films synergistically. Composite films made from black wolfberry anthocyanins exhibited higher mechanical performance than those made from purple tomato anthocyanins but weaker antibacterial effects. The purple tomato anthocyanins/chitosan and nano-ZnO/purple tomato anthocyanins/chitosan films effectively reflected pork spoilage, changing their colors from dark green to brown, indicating the potential for applications in active and intelligent food packaging.

关键词： bio-based multifunction colorimetric indicator active and intelligent packaging

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ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE

《农业科学与工程前沿（英文）》 2023年第10卷第1期页码 95-108 doi: 10.15302/J-FASE-2022478

摘要：

● Consumer preference for environmentally-friendly beverage packaging was investigated.

关键词： China consumer preference food and beverage packaging green identity label information treatment plastics

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Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

《机械工程前沿（英文）》 2017年第12卷第4期页码 490-509 doi: 10.1007/s11465-017-0484-4

摘要：

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the . The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

关键词： direct-write additive manufacturing microfabrication MEMS

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Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

《机械工程前沿（英文）》 2017年第12卷第4期页码 526-538 doi: 10.1007/s11465-017-0451-0

摘要：

Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.

关键词： differential scanning calorimetry biomolecule MEMS thermodynamic

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Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue

Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti

《化学科学与工程前沿（英文）》 2020年第14卷第2期页码 288-303 doi: 10.1007/s11705-019-1875-3

摘要： A synthetic mixture of real waste packaging plastics representative of the residue from a material recovery facility (plasmix) was submitted to thermal and catalytic pyrolysis. Preliminary thermogravimetry experiments coupled with Fourier transform infrared spectroscopy were performed to evaluate the effects of the catalysts on the polymers’ degradation temperatures and to determine the main compounds produced during pyrolysis. The thermal and catalytic experiments were conducted at 370°C, 450°C and 650°C using a bench scale reactor. The oil, gas, and char yields were analyzed and the compositions of the reaction products were compared. The primary aim of this study was to understand the effects of zeolitic hydrogen ultra stable zeolite Y (HUSY) and hydrogen zeolite socony mobil-5 (HZSM5) catalysts with high silica content on the pyrolysis process and the products’ quality. Thermogravimetry showed that HUSY significantly reduces the degradation temperature of all the polymers—particularly the polyolefines. HZSM5 had a significant effect on the degradation of polyethylene due to its smaller pore size. Mass balance showed that oil is always the main product of pyrolysis, regardless of the process conditions. However, all pyrolysis runs performed at 370°C were incomplete. The use of either zeolites resulted in a decrease in the heavy oil fraction and the prevention of wax formation. HUSY has the best performance in terms of the total monoaromatic yield (29 wt-% at 450°C), while HZSM5 promoted the production of gases (41 wt-% at 650°C). Plasmix is a potential input material for pyrolysis that is positively affected by the presence of the two tested zeolites. A more effective separation of polyethylene terephthalate during the selection process could lead to higher quality pyrolysis products.

关键词： packaging plastics waste plasmix pyrolysis zeolite catalyst degradation temperature

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

《机械工程前沿（英文）》 2017年第12卷第4期页码 557-566 doi: 10.1007/s11465-017-0441-2

摘要：

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

关键词： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

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A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

《机械工程前沿（英文）》 2023年第18卷第2期 doi: 10.1007/s11465-023-0747-1

摘要： Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10⁻⁷)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

关键词： micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement

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微系统研究的思考和单芯片RF-MEMS研究进展

钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良

《中国工程科学》 2004年第6卷第7期页码 21-25

摘要：文章阐述了微系统研究的意义以及微系统基础研究的重要性，概述了用于无线通信设备的MEMS器件的性能，指出了MEMS技术是最终实现单芯片机电一体化无线收发系统的根本途径之一，介绍了用于无线通信网络的单芯片机电一体化的微系统研究进展情况

关键词：微系统集成单芯片无线通信系统

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combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

《信息与电子工程前沿（英文）》 2015年第16卷第6期页码 497-510 doi: 10.1631/FITEE.1400349

摘要： The bias drift of a micro-electro-mechanical systems (MEMS) accelerometer suffers from the 1/ noise and the temperature effect. For massive applications, the bias drift urgently needs to be improved. Conventional methods often cannot address the 1/ noise and temperature effect in one architecture. In this paper, a combined approach on closed-loop architecture modification is proposed to minimize the bias drift. The modulated feedback approach is used to isolate the 1/ noise that exists in the conventional direct feedback approach. Then a common mode signal is created and added into the closed loop on the basis of modulated feedback architecture, to compensate for the temperature drift. With the combined approach, the bias instability is improved to less than 13 μ , and the drift of the Allan variance result is reduced to 17 μ at 100 s of the integration time. The temperature coefficient is reduced from 4.68 to 0.1 m /°C. The combined approach could be useful for many other closed-loop accelerometers.

关键词： Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation

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基于玻璃通孔的Ka波段宽带滤波封装天线 Research Article

方针1,2,张继华1,2,3,高莉彬1,2,陈宏伟1,2,李文磊1,2,梁天鹏1,2,蔡旭东1,2,蔡星周3,贾惟聪3,郭欢3,李勇3

《信息与电子工程前沿（英文）》 2023年第24卷第6期页码 916-926 doi: 10.1631/FITEE.2200573

摘要：以玻璃封装材料和玻璃通孔技术为基础，提出一种新的Ka波段(33 GHz)滤波封装天线(FPA)，该天线具有宽频带和高滤波响应特点。与传统封装材料(印刷电路板、低温共烧陶瓷、硅等)相比，玻璃通孔更适合小型化技术(毫米波三维封装器件)，具有优越的微波性能。玻璃基板通过键合技术可实现三维高密度互联，其热膨胀系数与硅相当。此外，玻璃基板的堆叠实现了高密度互连，并与微电子技术兼容。该天线辐射贴片由贴片天线和反射系数几乎互补的带通滤波器(BPF)组成。BPF单元有3对λg/4槽(缺陷微带结构)和两对λg/2 U形缝隙(缺陷地结构)。该天线实现了大带宽和高辐射效率，这可能与玻璃基板的叠加和玻璃通孔馈电有关。此外，引入4个辐射零值可有效提高阻带内的抑制水平。为验证所提设计性能，对33 GHz宽带滤波天线进行优化、调试和测量。天线的工作带宽为29.4‒36.4 GHz (|S11|<−10 dB)，阻抗匹配带宽高达21.2%，阻带抑制水平大于16.5 dB。该天线实际增益为~6.5 dBi，辐射效率为~89%。

关键词：滤波封装天线；玻璃通孔；三维封装器件；激光键合

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Development and application of high-end aerospace MEMS

Weizheng YUAN

《机械工程前沿（英文）》 2017年第12卷第4期页码 567-573 doi: 10.1007/s11465-017-0424-3

摘要：

This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.

关键词： MEMS design and manufacture technology aeronautic and aerospace